昇貿PF735-P267J低熔点膏体专为喷射点胶而设计

• 作者:
• 来源: MW Associates
• 日期: 2022-05-17
• 浏览次数: 1062次

SHENMAO PF735-P267J Low Melting Point Paste Is Designed for Jet Dispensing
SAN JOSE, CA ― May 2022 ― SHENMAO America, Inc. offers PF735-P267J Low Melting
Point Lead-Free Jetting Solder Paste specially designed for the jetting process. It offers
excellent workability and solderability for automatic high-speed jetting production with superior
accuracy and precision.

Compared to contact dispensing, jet dispensing can significantly improve production speeds by
eliminating the need for Z-axis movement. Jet dispensing also makes it easier to deposit solder
paste onto surfaces of varying heights.



The low melting point alloy can reduce the reflow temperature to below 190°C compared to
lead-free soldering, typically 240°-250°C, decreasing PCB and substrate deformation.
Additionally, PF735-P267J provides energy savings, reduces the thermal stability requirement
of PCBs and components, and raises yield rates.

PF735-P267J is halogen-free (ROL0) and complies with RoHS 2.0 and REACH. Powder size
ranges from type 5 to type 7 for fine dot jetting. It is suitable for fine pitch and ultra-fine pitch
applications and devices with uneven, cavities and other difficult to print locations.

Dot volume, size and shape are easy to adjust and optimize for each individual component and
pad on the board by using the jetting system, and thus it’s applicable for fine pitch devices and
also minimizes failure rate in production.

For more information, please visit www.shenmao.com.


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昇貿PF735-P267J低熔点膏体专为喷射点胶而设计
加利福尼亚州圣何塞2022年5月神茂美国公司提供专为喷射工艺设计的PF735-P267J低熔点无铅喷射锡膏。它为自动高速喷射生产提供了卓越的可加工性和可焊性，具有极高的精度和精密度。

与接触式点胶相比，喷射式点胶通过消除Z轴移动的需要，可以显著提高生产速度。喷射点胶还可以更容易地将锡膏沉积到不同高度的表面

与无铅焊接相比，低熔点合金可以将回流温度降低到190°C以下，通常为240°-250°C，从而减少PCB和基板变形。此外，PF735-P267J还可以节约能源，降低PCB和组件的热稳定性要求，并提高成品率。

PF735-P267J不含卤素（ROL0），符合RoHS 2.0和REACH标准。细点喷射的粉末粒度范围从5型到7型。它适用于细间距和超细间距应用，以及具有不均匀、空腔和其他难以打印位置应用程序和设备。

通过使用喷射系统，圆点体积、大小和形状易于调整和优化电路板上的每个单独组件和焊盘，因此适用于细间距设备，并将生产中的故障率降至最低

欲了解更多信息，请访问www.shenmao。