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SMT讯息
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  • 作者:
  • 来源: Indium
  • 日期: 2018-08-26
  • 浏览次数: 369
Indium Corporation Features Indium3.2HF Solder Paste for Fine Feature Printing at SEMICON Taiwan
 
Indium Corporation will feature its Indium3.2HF Solder Paste at SEMICON Taiwan 2018September 5-7 in Taipei, Taiwan.
 


Indium Corporation’s Indium3.2HF is a water-soluble, halogen-free, Pb-free solder paste. Indium3.2HF formulated with Indium Corporation’s Type 6SG powder is ideal for fine feature printing applications.
 
Indium3.2HF offers consistent, repeatable printing performance combined with a long stencil life. In addition, Indium3.2HF delivers:
·Good response-to-pause
·A wide reflow profile window
·Outstanding slump resistance
·Excellent wetting capability
·Superior fine-pitch soldering ability
 
From water-soluble solder pastes to ultra-low residue, no-clean fluxes, Indium Corporation has an industry-proven portfolio of products that meet the current and evolving challenges encountered in fine-pitch SiP applications.
 
For more information on Indium Corporation’s materials for SiP or Indium3.2HF Solder Paste,visit www.indium.com/SiP or visit Indium Corporation’s booth J2240.
 
For more information about Indium Corporation, visit www.indium.com or emailabrown@indium.com. You can also follow our experts, From One Engineer To Another®(#FOETA), at www.facebook.com/indium or @IndiumCorp.
 

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