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  • 来源: Indium
  • 日期: 2018-08-26
  • 浏览次数: 179
 
Indium Corporation Features WS-446HF Flip-Chip and WS-823 Ball-Attach Fluxes at SEMICON Taiwan
 
Indium Corporation will feature its Flip-Chip Flux WS-446HF and Ball Attach Flux 
WS-823 at SEMICON Taiwan 2018 Sept. 5-7 in Taipei, Taiwan.
 


Indium Corporation’s WS-446HF is a water-soluble, halogen-free flip-chip dipping flux with an activator system powerful enough to promote wetting on the most demanding surfaces; from solder-on-pad (SoP) to standard and embedded trace substrates (ETS) and flip-chip on leadframe applications. WS-446HF provides uniform dipping performance over extended periods of time. It also exhibits tackiness that is suitable for holding large die in place during assembly.

WS-823 is a water-soluble, halogen-free ball-attach flux designed for use in pin transfer and printing applications for ball attachment to substrates (BGA manufacturing). WS-823 has an activator system powerful enough to promote wetting on the most demanding substrate metallizations, such as copper OSP. WS-823 is cleanable with just DI water only.
 
From water-soluble and ultra-low/near-zero residue no-clean flip-chip fluxes to system-in-package (SiP) water-soluble and no-clean solder pastes, Indium Corporation has an industry-proven portfolio of products that meet the current and evolving challenges encountered in fine-pitch SiP and Heterogeneous Integration applications.
 
For more information on Indium Corporation’s materials for SiP, visit www.indium.com/SiP or visit Indium Corporation’s booth J2240.
 
For more information about Indium Corporation, visit www.indium.com or emailabrown@indium.com. You can also follow our experts, From One Engineer To Another®(#FOETA), at www.facebook.com/indium or @IndiumCorp.
 

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